Call for Papers TAIC PART 2016 – 11th Workshop on Testing: Academia-Industry Collaboration, Practice and Research Techniques http://www.taicpart.org/ April 11, 2016, Chicago, IL, USA Co-located with IEEE International Conference on Software Testing, Verification and Validation (ICST 2016) +++ TRICENTIS Best Paper Award +++ The best paper wins an iPad Air 2! Kindly sponsored by Tricentis - The Continuous Testing Company (http://www.tricentis.com). The best paper will be selected from the submitted regular papers based on the reviews by the program committee. +++ Important Dates +++ Submission: January 22, 2016 Notification: February 19, 2016 Workshop: April 11, 2016 +++ Theme and Goals +++ TAIC PART is a workshop co-located with ICST 2016 that aims to forge collaboration between industry and academia on the challenging and exciting problem of real-world software testing. It is promoted by representatives of both industry and academia, bringing together industrial software engineers and testers with researchers working on theory and practice of software testing. The goals of TAIC PART range from the articulation of research questions in the field of software testing and analysis to practical challenges faced in industry. The common theme is the discussion and advancement of approaches and methods for sustainable collaboration between academia and industry in software testing. +++ Topics of Interest +++ TAIC PART invites submissions relevant to practice and research including + Industry experience reports: practical and generalizable insights into how to apply and extend existing approaches to software testing and analysis + Research methods for collaborative research: ways that industry and academia can collaborate to further knowledge on testing, verification and validation + Industrial challenges with real-world testing: describe a real-world software testing problem for which industry seeks help from academia or vice versa + Knowledge exchange between industry and academia: how can new results and knowledge be exchanged between the two partners +++ Submission and Proceedings +++ + Regular Papers (6 pages): Experience reports, research papers, longer challenge papers (extension up to 10 pages may be possible on request) + Fast Abstracts (up to 2 pages): Challenges in practice and research, work in progress, positions statements Authors should submit a PDF version of their paper through the TAIC PART 2016 paper submission site: http://easychair.org/conferences/?conf=taicpart2016. All accepted papers will be part of the ICST joint workshop proceedings published in the IEEE Digital Library. +++ Organization and Contact +++ + Rudolf Ramler, Software Competence Center Hagenberg, Austria (General Chair) + Michael Felderer, University of Innsbruck, Austria (Program Co-Chair) + Takashi Kitamura, National Institute of Advanced Industrial Science and Technology (AIST), Japan (Program Co-Chair) + Darko Marinov, University of Illinois at Urbana-Champaign, USA (Local Chair) If you have any questions or require more information on TAIC PART 2016, please visit 2016/ or write to rudolf.ramler(at)scch.at. +++ Program Committee +++ Pekka Aho, VTT, Finland Cyrille Artho, Nat. Inst. of Advanced Industrial Science and Technology, Japan Jeff Ayars, Groupon, USA Sigrid Eldh, Ericsson AB, Sweden Emelie Engström, Lund University, Sweden Vladimir Entin, OMICRON electronics, Austria Robby Findler, Northwestern University, USA Elizabeta Fourneret, University of Franche-Comté, France Vahid Garousi, Yusifoglu Atilim University, Turkey Mark Harman, University College London, United Kingdom Sam King, Twitter Inc., USA Bogdan Korel, Illinois Institute of Technology, USA Johann Krautlager, Airbus Helicopters, Germany Shan Lu, University of Chicago, USA Mika Mäntylä, University of Oulu, Finland Stefan Mohacsi, Atos, Austria Shin Nakajima, National Institute of Informatics, Japan Reinhold Plösch, Johannes Kepler University Linz, Austria Mukul Prasad, Fujitsu, USA Ina Schieferdecker, Fraunhofer FOKUS, Germany Per Runeson, Lund University, Sweden Haruto Tanno, NTT, Japan Guilherme Travassos, Federal University of Rio de Janeiro, Brazil Tatsuhiro Tsuchiya, Osaka University, Japan Peter Zimmerer, Siemens Corporate Technology, Germany